Broadcom provides a recommended PCB layout and land pattern in their application note AN1145, which can be found on their website. It's essential to follow these guidelines to ensure optimal performance and minimize signal degradation.
The HSMP-389Z-TR1G has a thermal pad that must be connected to a thermal ground plane on the PCB to dissipate heat efficiently. A thermal via or a thermal pad connected to a heat sink can also be used. Ensure that the thermal design is adequate to prevent overheating and reduce the risk of device failure.
Broadcom recommends using a reflow soldering process with a peak temperature of 260°C (500°F) for a maximum of 20 seconds. Hand soldering is not recommended due to the risk of overheating and damaging the device.
The HSMP-389Z-TR1G requires a bias voltage of 3.3V to 5V, and the bias current should be limited to 10mA. Ensure that the bias circuitry is designed to provide a stable voltage and current to the device. Consult the datasheet and application notes for more information on biasing and circuit design.
The HSMP-389Z-TR1G is designed to operate up to 38.7 GHz, but the actual operating frequency may be limited by the specific application and PCB design. Ensure that the device is operated within its specified frequency range to maintain optimal performance and prevent damage.
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