Broadcom recommends a 4-layer PCB with a solid ground plane and thermal vias to dissipate heat. A thermal pad on the bottom of the package should be connected to a thermal plane on the PCB.
Use a differential pair layout for high-speed signals, keep signal traces short and away from noise sources, and use EMI shielding and filtering as needed. Follow Broadcom's recommended PCB layout guidelines.
The maximum operating temperature range for HSMF-C114 is -40°C to 125°C. However, the device can be operated at a reduced performance level up to 150°C for short periods.
Use Broadcom's proprietary software development kit (SDK) and programming tools, such as the Broadcom Switch Configuration Tool, to configure and program the HSMF-C114.
The HSMF-C114 has a typical power consumption of 1.5W. Power management options include power-down modes, clock gating, and dynamic voltage and frequency scaling.
HSMF-C114 datasheet
by Avago Technologies
