The maximum junction temperature of the HF900GS is 150°C, as specified in the datasheet. However, it's recommended to keep the junction temperature below 125°C for optimal performance and reliability.
To minimize EMI and noise, it's recommended to follow a star-grounding scheme, keep the input and output capacitors close to the IC, and use a solid ground plane. Additionally, use a shielded inductor and keep the switching node (SW pin) away from sensitive nodes.
The recommended input capacitor type is a low-ESR ceramic capacitor, such as X5R or X7R, with a value of 10uF to 22uF. This helps to filter out input noise and ensure stable operation.
While the HF900GS can operate up to 150°C, it's not recommended to use it in high-temperature environments above 125°C for extended periods. This can affect the IC's reliability and lifespan. If high-temperature operation is required, consider using a heat sink or a thermally-enhanced package.
The output voltage ripple of the HF900GS can be calculated using the formula: ΔVout = (Iout * ESL) / (Cout * fsw), where ESL is the equivalent series inductance of the output capacitor, Cout is the output capacitance, and fsw is the switching frequency.
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