A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the signal traces short and away from the power plane to minimize noise and EMI.
Ensure good thermal design, including a heat sink and thermal interface material. Operate within the recommended temperature range (-40°C to 125°C) and consider derating the device for high-temperature applications.
Power up the device in the following sequence: VCC, AVCC, and then DVCC. Ramp up the voltage slowly (e.g., 1-2 ms) to prevent latch-up and ensure reliable operation.
Use a logic analyzer or oscilloscope to monitor the device's signals and identify the source of the issue. Check the power supply, clock signals, and reset lines for anomalies. Consult the datasheet and application notes for troubleshooting guidelines.
Yes, but ensure that the device meets the specific requirements of the standard. Consult the datasheet and relevant industry standards (e.g., AEC-Q100, DO-254) for compliance guidelines.