The recommended storage condition for H11G3 is in a dry, cool place with a temperature range of 10°C to 30°C and humidity below 60%. This helps to prevent moisture absorption and degradation of the component.
While H11G3 can operate up to 150°C, it's not recommended for continuous use above 125°C. Prolonged exposure to high temperatures can affect the component's reliability and lifespan. If high-temperature operation is required, consider using a different component or consulting with Isocom Components for guidance.
H11G3 is an electrostatic-sensitive device (ESD). To prevent damage, handle the component in an ESD-protected environment, use ESD-safe tools and equipment, and follow proper grounding procedures. Ensure that your workspace and personnel are ESD-compliant.
The recommended soldering profile for H11G3 is a peak temperature of 260°C for 10-15 seconds, with a ramp-up rate of 2-3°C/second and a ramp-down rate of 4-6°C/second. This helps prevent thermal shock and ensures reliable solder joints.
H11G3 is not designed for use in humid or wet environments. Moisture can cause corrosion, degradation, or electrical failures. If your application requires operation in humid or wet conditions, consider using a different component or applying conformal coating or potting to protect the device.
