The recommended storage condition for H11B1 is in a dry, cool place, away from direct sunlight and moisture, with a temperature range of -20°C to 40°C and humidity below 60%.
To prevent electrostatic discharge (ESD) damage, handle H11B1 components with an anti-static wrist strap or mat, and ensure that all equipment and tools are properly grounded.
The maximum soldering temperature for H11B1 is 260°C for a maximum of 10 seconds, with a peak temperature of 240°C for 5 seconds.
Yes, H11B1 is suitable for high-reliability applications, such as aerospace, defense, and medical devices, due to its high-quality materials and manufacturing process.
Clean H11B1 components with a soft brush and a mild detergent solution, avoiding harsh chemicals, ultrasonic cleaning, or high-pressure washing, which can damage the component.
