GTL2014PW,112 datasheet by NXP Semiconductors

GTL2014PW,112 Frequently Asked Questions (FAQs)

• What is the recommended PCB layout for GTL2014PW,112?
  NXP provides a recommended PCB layout in the application note AN11173, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and reliability.
• How do I handle the thermal management of GTL2014PW,112?
  The GTL2014PW,112 has a thermal pad that must be connected to a solid ground plane on the PCB to dissipate heat. A thermal via array or a thermal pad with a heat sink can be used to improve heat dissipation. The application note AN11173 provides more details on thermal management.
• What is the maximum operating temperature range for GTL2014PW,112?
  The GTL2014PW,112 has an operating temperature range of -40°C to +85°C, but it's recommended to operate within -20°C to +70°C for optimal performance and reliability.
• How do I configure the GTL2014PW,112 for different voltage levels?
  The GTL2014PW,112 is a programmable device, and the voltage levels can be configured using the I2C interface. The device has a built-in voltage regulator that can be programmed to output 1.2V, 1.5V, 1.8V, or 2.5V. The NXP documentation provides more information on programming the device.
• What is the maximum current rating for GTL2014PW,112?
  The GTL2014PW,112 has a maximum current rating of 1.2A per output, but it's recommended to limit the current to 1A per output to ensure reliable operation and prevent overheating.