GBJ3501-BP datasheet by Micro Commercial Components

GBJ3501-BP Frequently Asked Questions (FAQs)

• What is the recommended PCB footprint for the GBJ3501-BP?
  The recommended PCB footprint for the GBJ3501-BP is a standard 1206 package with a pad size of 1.3mm x 1.3mm and a spacing of 0.5mm between pads.
• Can the GBJ3501-BP be used in high-temperature applications?
  Yes, the GBJ3501-BP is rated for operation up to 150°C, making it suitable for high-temperature applications. However, it's essential to ensure proper thermal management and follow the recommended derating guidelines.
• How do I ensure the reliability of the GBJ3501-BP in high-reliability applications?
  To ensure reliability, follow proper handling and storage procedures, use a clean and dry environment, and avoid exposing the device to mechanical stress or electrical overstress. Additionally, consider using a conformal coating and following the recommended soldering profile.
• What is the typical lead time for the GBJ3501-BP?
  The typical lead time for the GBJ3501-BP varies depending on the supplier and the quantity required. However, it's usually around 4-6 weeks for standard orders. It's recommended to check with the supplier or distributor for the most up-to-date lead time information.
• Is the GBJ3501-BP RoHS and REACH compliant?
  Yes, the GBJ3501-BP is RoHS (Restriction of Hazardous Substances) and REACH (Registration, Evaluation, Authorization, and Restriction of Chemicals) compliant, making it suitable for use in EU and other regions with similar regulations.