GBJ1008-BP datasheet by Micro Commercial Components

GBJ1008-BP Frequently Asked Questions (FAQs)

• What is the recommended PCB footprint for the GBJ1008-BP?
  The recommended PCB footprint for the GBJ1008-BP is a rectangular pad with dimensions of 1.2mm x 0.8mm, with a 0.5mm radius corner and a 0.2mm spacing between pads.
• Can the GBJ1008-BP be used in high-temperature applications?
  Yes, the GBJ1008-BP is rated for operation up to 150°C, making it suitable for high-temperature applications. However, the device's performance and reliability may degrade at temperatures above 125°C.
• What is the maximum surge current that the GBJ1008-BP can withstand?
  The GBJ1008-BP can withstand a maximum surge current of 100A for a duration of 10ms, according to the manufacturer's specifications.
• Is the GBJ1008-BP compatible with lead-free soldering processes?
  Yes, the GBJ1008-BP is compatible with lead-free soldering processes, including SAC305 and Sn96.5Ag3Cu0.5. However, the manufacturer recommends following the recommended soldering profile to ensure reliable assembly.
• What is the typical junction-to-ambient thermal resistance of the GBJ1008-BP?
  The typical junction-to-ambient thermal resistance of the GBJ1008-BP is 25°C/W, which means that the device can dissipate up to 1W of power without exceeding the maximum junction temperature of 150°C.