A recommended PCB layout for optimal thermal performance would be to have a large copper area connected to the thermal pad, with multiple vias to the bottom layer to dissipate heat efficiently.
To ensure the device is properly biased, make sure to follow the recommended voltage and current ratings, and use a stable voltage regulator to minimize noise and ripple.
To prevent ESD damage, handle the device in an ESD-safe environment, use ESD-safe tools and packaging, and ensure that all personnel handling the device are grounded.
While the FMMT619TC is rated for operation up to 150°C, it's essential to consider the device's power dissipation and thermal management when operating in high-temperature environments to prevent overheating.
To troubleshoot issues, start by verifying the device is properly biased and configured, then check for any signs of physical damage or contamination. Use a thermal camera or thermometer to monitor temperature, and an oscilloscope to monitor voltage and current.