A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat. A minimum of 2oz copper thickness is recommended. Additionally, vias should be placed under the thermal pad to connect to a solid copper plane on the bottom layer.
The FMMT591ATC requires a bias voltage of 5V to 15V. A stable voltage regulator should be used to ensure a clean and stable bias voltage. Additionally, decoupling capacitors should be placed close to the device to filter out noise and ensure stable operation.
The FMMT591ATC can handle a maximum continuous current of 1A. However, the device can handle higher currents for short durations. It's essential to ensure the device is properly heatsinked and the PCB is designed to handle the maximum current.
The FMMT591ATC has built-in ESD protection, but additional protection measures can be taken. A TVS diode or a zener diode can be used to protect the device from overvoltage. Additionally, a series resistor can be used to limit the current and prevent damage from ESD events.
The FMMT591ATC should be stored in a dry, cool place away from direct sunlight. The device should be handled with anti-static wrist straps or mats to prevent ESD damage. The device should not be exposed to temperatures above 150°C during soldering or rework.
FMMT591ATC datasheet
by Diodes Incorporated
