A good PCB layout for the FLC10-200B involves keeping the input and output tracks as short as possible, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a dedicated ground plane is recommended.
To ensure proper biasing, connect the VCC pin to a stable voltage source (e.g., 5V or 3.3V) and decouple it with a 10uF capacitor. The VEE pin should be connected to a stable voltage source (e.g., -5V or -3.3V) or to ground if not used. The VREF pin should be connected to a stable voltage reference (e.g., 2.5V).
The maximum power dissipation of the FLC10-200B is 1.4W. However, this value can be affected by the operating conditions, such as ambient temperature, supply voltage, and output current. It's essential to ensure the device operates within the recommended operating conditions to avoid overheating.
The FLC10-200B is rated for operation up to 125°C. However, the device's performance and reliability may degrade at high temperatures. It's essential to ensure the device operates within the recommended operating temperature range (typically -40°C to 125°C) to maintain optimal performance and reliability.
To protect the FLC10-200B from ESD, handle the device by the body or use an anti-static wrist strap. Ensure the PCB is designed with ESD protection in mind, using components such as TVS diodes or ESD protection arrays. Store the device in an anti-static bag or wrap it in anti-static material when not in use.
FLC10-200B datasheet
by STMicroelectronics
