The recommended land pattern for FK3506010L is a rectangular pad with a size of 2.5mm x 1.25mm, with a solder mask opening of 2.2mm x 1.0mm. It's essential to follow the recommended land pattern to ensure reliable soldering and to prevent thermal stress.
To ensure reliable operation, it's crucial to provide adequate thermal management for FK3506010L. This can be achieved by providing a thermal pad on the PCB, using a heat sink, and ensuring good airflow around the component. The thermal resistance of the component is 10°C/W, and the maximum operating temperature is 150°C.
The recommended soldering profile for FK3506010L is a peak temperature of 260°C, with a dwell time of 10-30 seconds above 220°C. It's essential to follow a controlled soldering profile to prevent thermal shock and ensure reliable solder joints.
While FK3506010L is a robust component, it's essential to consider the vibration environment in which it will operate. Panasonic recommends that the component be secured using a suitable adhesive or mechanical fastening to prevent movement and ensure reliable operation in high-vibration environments.
The equivalent series resistance (ESR) of FK3506010L is 0.015Ω, which is relatively low and suitable for high-frequency applications. This low ESR ensures minimal energy loss and heat generation, making it suitable for high-power applications.
FK3506010L datasheet
by Panasonic Electronic Components
