The recommended PCB layout for optimal thermal performance involves using a 2-layer or 4-layer board with a solid ground plane, placing thermal vias under the device, and using a thermal pad on the bottom of the device. Additionally, keeping the PCB traces away from the device and using a heat sink can help to improve thermal performance.
To ensure reliable operation in high-temperature environments, it is recommended to follow the device's thermal derating guidelines, use a heat sink, and ensure good airflow around the device. Additionally, selecting components with high-temperature ratings and using thermal interface materials can help to improve reliability.
Key considerations for EMI and RFI mitigation include using a shielded enclosure, keeping the device away from antennas and other EMI sources, using EMI filters, and following good PCB layout practices such as separating analog and digital circuits and using ground planes.
To optimize the device for low-power operation, it is recommended to use the lowest possible supply voltage, reduce the switching frequency, and use a low-power mode when possible. Additionally, using a high-efficiency power supply and minimizing the number of active circuits can help to reduce power consumption.
Recommended test and measurement techniques for characterizing the device include using a curve tracer or oscilloscope to measure voltage and current waveforms, and using a thermal camera or thermocouple to measure temperature. Additionally, using a network analyzer or spectrum analyzer can help to measure frequency response and noise characteristics.
FDMS86150A datasheet
by onsemi
