ECL15US03-S datasheet by XP Power

ECL15US03-S Frequently Asked Questions (FAQs)

• What is the recommended PCB layout for optimal thermal performance?
  XP Power recommends a PCB layout with a large copper area connected to the tab of the device to dissipate heat effectively. A minimum of 1 oz copper thickness is recommended, and the copper area should be at least 1 inch x 1 inch in size.
• Can I use this converter in a high-vibration environment?
  Yes, the ECL15US03-S is designed to meet the requirements of IEC 60068-2-6 for vibration, which includes 10-2000 Hz, 2G acceleration, and 1 octave/minute sweep rate. However, it's recommended to consult with XP Power's application engineers for specific vibration requirements.
• What is the maximum capacitance I can use on the output?
  The maximum capacitance on the output is limited by the stability of the converter. XP Power recommends a maximum capacitance of 220uF to ensure stability and prevent oscillations.
• Can I use this converter in a sealed enclosure?
  Yes, but it's essential to ensure adequate airflow and heat dissipation. The converter's thermal design is based on natural convection, so it's crucial to provide sufficient clearance around the device and ensure that the enclosure doesn't obstruct airflow.
• What is the MTBF (Mean Time Between Failures) of this converter?
  According to XP Power's reliability data, the MTBF of the ECL15US03-S is approximately 1.5 million hours at 25°C, calculated using the MIL-HDBK-217F method.