STMicroelectronics recommends a 2-layer PCB with a solid ground plane on the bottom layer and a thermal relief pattern on the top layer to ensure optimal thermal performance.
To ensure reliable operation in high-temperature environments, it's essential to follow the recommended thermal design guidelines, use a suitable thermal interface material, and consider derating the device's power dissipation according to the ambient temperature.
Monitor the output voltage, output current, and internal temperature to detect faults and protect the device. Implement overvoltage protection, undervoltage protection, and overcurrent protection to prevent damage.
Yes, the E-L6219DS013TR is suitable for high-reliability applications. STMicroelectronics provides a dedicated high-reliability version of the device, which undergoes additional screening and testing to ensure exceptional reliability.
To optimize the device's performance for low-power applications, consider using a low-dropout linear regulator, optimizing the output capacitor selection, and minimizing the quiescent current by using a low-power mode or shutdown feature.
E-L6219DS013TR datasheet
by STMicroelectronics
