The recommended PCB footprint for the DZ2S068M0L is a rectangular pad with dimensions of 3.5mm x 2.5mm, with a 0.5mm radius corner. The pad should be centered on the component and have a solder mask defined gap of 0.2mm.
To ensure reliable soldering of the DZ2S068M0L, use a soldering iron with a temperature of 250°C to 270°C, and apply a small amount of solder paste to the PCB pad. Use a soldering technique that minimizes the risk of overheating the component.
The maximum operating temperature range for the DZ2S068M0L is -40°C to 125°C. However, it's recommended to operate the component within a temperature range of -20°C to 85°C for optimal performance and reliability.
Yes, the DZ2S068M0L is designed to withstand high-vibration environments. However, it's recommended to follow proper mounting and soldering techniques to ensure the component remains securely attached to the PCB.
To handle the DZ2S068M0L for optimal ESD protection, use an ESD wrist strap or mat, and ensure that the component is stored in an ESD-protected environment. Avoid touching the component's pins or leads, and use ESD-safe packaging materials.
DZ2S068M0L datasheet
by Panasonic Electronic Components
