ROHM recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended, and the thermal pad should be connected to a ground plane or a dedicated heat sink.
The DTA123EEBTL requires a bias voltage of 2.5V to 5.5V on the VCC pin, and the input voltage on the VIN pin should be within the specified range. Ensure that the bias voltage is stable and noise-free, and that the input voltage is filtered to prevent noise and ripple.
The maximum power dissipation for the DTA123EEBTL is 1.5W. However, this value can be derated based on the ambient temperature and the thermal resistance of the PCB. ROHM provides a thermal derating curve in the datasheet to help calculate the maximum allowable power dissipation.
ROHM recommends using ESD protection devices, such as TVS diodes or ESD arrays, on the input and output pins to protect the DTA123EEBTL from electrostatic discharge. Additionally, overvoltage protection devices, such as voltage regulators or overvoltage protection ICs, can be used to prevent damage from voltage spikes or surges.
ROHM recommends storing the DTA123EEBTL in a dry, cool place with a temperature range of -20°C to 40°C and a relative humidity of 60% or less. Avoid storing the device in direct sunlight, high-temperature environments, or areas with high humidity.
