For optimal thermal performance, it is recommended to use a 4-layer PCB with a solid ground plane on the bottom layer, and to place thermal vias under the device to dissipate heat effectively.
To ensure reliable operation across the full temperature range, it is recommended to follow the recommended operating conditions, use a suitable thermal design, and ensure that the device is properly decoupled and bypassed.
Key considerations for EMI and RFI mitigation include using a shielded enclosure, keeping signal lines short and away from the device, using a common-mode choke, and following good PCB layout practices.
To troubleshoot issues with the device's output voltage regulation, check the input voltage, output voltage, and feedback resistors, and ensure that the device is properly configured and that the output capacitor is suitable for the application.
Operating the device at high temperatures can reduce its reliability and lifespan, and may also affect its performance and accuracy. It is recommended to follow the recommended operating temperature range and to use a suitable thermal design.
DS96F173ME/883 datasheet
by Texas Instruments
