A good PCB layout for the DS91M040TSQX/NOPB involves keeping the signal traces short and direct, using a solid ground plane, and placing decoupling capacitors close to the device. TI provides a recommended PCB layout in the datasheet and application notes.
To ensure reliable operation in high-temperature environments, ensure proper heat sinking, use a thermal interface material, and follow the recommended operating conditions and thermal design guidelines provided in the datasheet.
To minimize EMI and RFI, use a shielded enclosure, keep signal traces short, use a common-mode choke, and follow good PCB layout practices. TI provides EMI and RFI mitigation guidelines in the datasheet and application notes.
To troubleshoot issues with the DS91M040TSQX/NOPB, use oscilloscopes and logic analyzers to analyze signal waveforms, check power supply voltage and current, and consult the datasheet and application notes for troubleshooting guidelines.
To ensure proper power sequencing and power-on reset, follow the recommended power-up and power-down sequences, use a power-on reset circuit, and consult the datasheet and application notes for guidelines.