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    Part Img DS90UR906QSQ/NOPB datasheet by Texas Instruments

    • DS90UR906 - 5-65MHz 24-bit Color FPD-Link II Deserializer 60-WQFN -40 to 105
    • Original
    • Yes
    • Yes
    • Active
    • EAR99
    • 8542.39.00.01
    • 8542.39.00.00
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    DS90UR906QSQ/NOPB datasheet preview

    DS90UR906QSQ/NOPB Frequently Asked Questions (FAQs)

    • Texas Instruments provides a recommended PCB layout guide in the DS90UR906QSQ/NOPB evaluation module user's guide, which includes guidelines for signal routing, power supply decoupling, and thermal management.
    • To ensure reliable operation over the entire operating temperature range, it is essential to follow the recommended operating conditions, including power supply voltage, clock frequency, and signal integrity guidelines. Additionally, thermal management and proper PCB design are crucial to prevent overheating and signal degradation.
    • The built-in test patterns are limited to a set of predefined patterns, and custom test patterns can be generated using the DS90UR906QSQ/NOPB's programmable pattern generator. Texas Instruments provides a software development kit (SDK) that allows users to create custom test patterns and load them into the device.
    • Texas Instruments provides a range of debugging tools and resources, including the DS90UR906QSQ/NOPB evaluation module, which includes built-in debugging capabilities. Additionally, the device's built-in error detection and correction mechanisms can help identify and diagnose issues. Consult the device's datasheet and application notes for more information on troubleshooting and debugging techniques.
    • The power consumption and thermal characteristics of the DS90UR906QSQ/NOPB are dependent on the operating conditions, including clock frequency, data rate, and power supply voltage. Consult the device's datasheet for detailed power consumption and thermal characteristics. To optimize power consumption and thermal performance, follow the recommended operating conditions, use power-saving features, and implement thermal management techniques such as heat sinking and thermal interface materials.
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