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    Part Img DS90CR484AVJDX/NOPB datasheet by Texas Instruments

    • DS90CR484 - 48-Bit LVDS Channel Link SER/DES - 33 - 112 MHz 100-TQFP -10 to 70
    • Original
    • Yes
    • Yes
    • Active
    • EAR99
    • 8542.39.00.01
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    DS90CR484AVJDX/NOPB datasheet preview

    DS90CR484AVJDX/NOPB Frequently Asked Questions (FAQs)

    • Texas Instruments provides a recommended PCB layout guide in the application note SLVAE04, which includes guidelines for signal routing, power supply decoupling, and thermal management to ensure optimal performance and minimize signal integrity issues.
    • To ensure reliable operation in high-temperature environments, it is essential to follow the recommended thermal management guidelines in the datasheet, including providing adequate heat sinking, using thermal interface materials, and ensuring good airflow around the device. Additionally, the device should be operated within the recommended operating temperature range of -40°C to 105°C.
    • The typical power consumption of the DS90CR484AVJDX/NOPB is around 1.2W, and the typical power dissipation is around 1.1W. However, these values can vary depending on the specific application, operating frequency, and output load. It is recommended to refer to the datasheet and application notes for more detailed power consumption and dissipation information.
    • To troubleshoot common issues with the DS90CR484AVJDX/NOPB, it is recommended to follow a systematic approach, including checking the PCB layout and signal routing, verifying the power supply and clock signals, and using oscilloscopes and logic analyzers to debug the signal transmission. Texas Instruments also provides a troubleshooting guide in the application note SLVAE03, which provides detailed guidance on identifying and resolving common issues.
    • Yes, the DS90CR484AVJDX/NOPB is a high-speed device that can be susceptible to electromagnetic interference (EMI) and radio-frequency interference (RFI). To minimize EMI and RFI, it is recommended to follow good design practices, such as using shielded cables, minimizing signal loop areas, and using EMI filters and absorbers. Additionally, the device should be operated in a shielded environment, and the PCB should be designed to minimize radiation and susceptibility to external interference.
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