Texas Instruments provides a recommended PCB layout in the DS90CR218A datasheet, which includes guidelines for trace routing, component placement, and thermal management. Additionally, TI offers a PCB layout checklist and a layout guide for FPD-Link III devices.
To ensure signal integrity and minimize EMI, follow the recommended PCB layout guidelines, use differential signaling, and implement proper shielding and grounding techniques. Additionally, use a common-mode filter and a shielded cable to reduce EMI. TI also provides a signal integrity guide for FPD-Link III devices.
The maximum cable length supported by the DS90CR218AMTDX/NOPB depends on the specific application and the type of cable used. However, as a general guideline, TI recommends a maximum cable length of 10 meters for FPD-Link III devices. Longer cable lengths may be possible with the use of repeaters or active cables.
The DS90CR218AMTDX/NOPB can be configured using the I2C interface or through the use of external resistors. TI provides a configuration guide and a register map in the datasheet, as well as a software development kit (SDK) for configuring and evaluating the device.
The power consumption of the DS90CR218AMTDX/NOPB depends on the specific application and the operating conditions. However, according to the datasheet, the typical power consumption is around 350 mW per channel. TI also provides a power consumption calculator tool to help estimate power consumption for specific designs.
DS90CR218AMTDX/NOPB datasheet
by Texas Instruments
