Texas Instruments recommends a 4-layer PCB with a solid ground plane and a separate power plane for the device. The device's thermal pad should be connected to the ground plane. A detailed layout guide is available in the application note 'DS90CP22MTX PCB Layout Guidelines' (SLUA533).
To ensure reliable operation in high-temperature environments, it is essential to provide adequate heat sinking and thermal management. The device's junction temperature (TJ) should be kept below 125°C. A heat sink or thermal pad can be used to dissipate heat. Additionally, the device's power consumption should be minimized by optimizing the clock frequency and voltage supply.
The maximum cable length supported by the DS90CP22MTX/NOPB depends on the specific application and the type of cable used. However, as a general guideline, the device can support cable lengths of up to 10 meters (33 feet) for FPD-Link III applications and up to 5 meters (16 feet) for OpenLDI applications.
To troubleshoot issues with the DS90CP22MTX/NOPB, start by verifying the power supply voltage and clock frequency. Check the device's output signals using an oscilloscope or logic analyzer. Consult the device's datasheet and application notes for troubleshooting guidelines and common issues. If the issue persists, contact Texas Instruments' support team for further assistance.
While the DS90CP22MTX/NOPB is optimized for FPD-Link III and OpenLDI applications, it can be used in other applications with proper design and testing. However, Texas Instruments does not provide explicit support for non-standard applications. It is essential to consult with Texas Instruments' support team and conduct thorough testing to ensure the device's reliability and performance in the target application.
DS90CP22MTX/NOPB datasheet
by Texas Instruments
