A good PCB layout for the DS36C278TM involves keeping the analog and digital grounds separate, using a solid ground plane, and placing the device close to the power supply. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
The DS36C278TM requires a single 3.3V power supply, and it's recommended to use a low-dropout linear regulator (LDO) to power the device. The power sequencing requirement is to power up the device after the power supply has stabilized, and to ensure that the power supply is within the recommended operating range.
The recommended clocking scheme for the DS36C278TM is to use a low-jitter clock source, such as a crystal oscillator or a high-quality clock generator. To minimize clock jitter, it's recommended to use a clock signal with a frequency of 25 MHz or higher, and to use a clock buffer or a clock conditioner to reduce jitter.
The DS36C278TM can be configured using the SPI interface, and the recommended settings depend on the specific application. In general, it's recommended to set the device to use the internal voltage reference, and to adjust the gain and offset settings based on the specific requirements of the application.
The DS36C278TM has a maximum junction temperature of 150°C, and it's recommended to ensure that the device operates within a temperature range of -40°C to 85°C. To ensure thermal considerations, it's recommended to use a heat sink or a thermal pad, and to ensure good airflow around the device.
DS36C278TM datasheet
by Texas Instruments
