Texas Instruments recommends a 4-layer PCB with a solid ground plane, and to keep the analog and digital signals separate. Use a star-connection for the power supply, and avoid routing signals under the device. Keep the input and output traces short and away from each other.
To optimize performance in high-temperature environments, ensure good thermal conductivity between the device and the PCB. Use a thermal pad or thermal tape to improve heat dissipation. Also, consider using a heat sink or a thermally conductive PCB material.
The recommended input impedance is 50 ohms, and the output impedance is 100 ohms. However, the device can operate with a wide range of impedances. Consult the datasheet for specific impedance values and their corresponding performance characteristics.
To troubleshoot common issues, start by verifying the power supply voltage and ensuring it is within the recommended range. Check the input and output impedance, and ensure proper PCB layout and routing. Use an oscilloscope to analyze the output waveform and identify any signs of oscillation or instability.
Texas Instruments recommends using 0.1uF to 1uF ceramic capacitors for decoupling, placed as close as possible to the device's power pins. Use a capacitor with a voltage rating that exceeds the maximum power supply voltage.