Texas Instruments provides a recommended PCB layout in the datasheet, but it's essential to follow good PCB design practices, such as keeping the analog and digital grounds separate, using a solid ground plane, and minimizing noise coupling. Additionally, ensure that the input and output traces are routed away from each other to prevent signal coupling.
The power-up sequence is critical for the DS36954MX/NOPB. Ensure that the VCC supply is powered up before the VDD supply. Also, the VCC supply should be powered up slowly (less than 10 ms) to prevent latch-up. It's recommended to use a power-up sequence controller or a voltage supervisor to ensure a proper power-up sequence.
The DS36954MX/NOPB can drive a maximum capacitive load of 100 pF. Exceeding this limit may cause instability or oscillations. If you need to drive a higher capacitive load, consider adding a buffer or using a device with a higher drive capability.
To ensure EMC, follow good design practices such as using a shielded enclosure, keeping the device away from noise sources, and using a common-mode choke or ferrite bead on the input lines. Additionally, ensure that the PCB layout is designed to minimize radiation and susceptibility to electromagnetic interference (EMI).
The thermal derating for the DS36954MX/NOPB is typically 1.5°C/W above 25°C. This means that for every 1°C increase in ambient temperature above 25°C, the device's power rating decreases by 1.5%. Ensure that the device is properly heat-sinked and that the ambient temperature is within the recommended operating range.