A good PCB layout for the DS32ELX0124SQE/NOPB should minimize signal trace lengths, use a solid ground plane, and keep analog and digital signals separate. TI provides a recommended layout in the datasheet, but it's also recommended to consult with a PCB design expert for optimal results.
To ensure reliable operation over the full temperature range, it's essential to follow proper thermal design practices, such as providing adequate heat sinking, using thermal interface materials, and ensuring good airflow. Additionally, consider using thermal simulation tools to model the device's thermal performance.
The recommended power-up sequence is to apply VCC first, followed by VDD, and then the input clock signal. For power-down, the sequence should be reversed. It's also essential to ensure that the input clock signal is stable before applying VCC and VDD.
To minimize EMI and ensure EMC, use proper shielding, grounding, and filtering techniques. Keep sensitive analog signals away from noisy digital signals, and use EMI-absorbing materials and shielding cans to reduce radiation. Consult with an EMI/EMC expert for specific guidance.
Use high-impedance probes and low-capacitance cables to minimize loading effects. For signal integrity measurements, use a high-bandwidth oscilloscope with a low-noise floor. For power integrity measurements, use a high-accuracy current probe and a low-noise voltage probe.
DS32ELX0124SQE/NOPB datasheet
by Texas Instruments
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