A good PCB layout practice is to use a multi-layer board with a solid ground plane, keep the signal traces short and away from the edge of the board, and use a termination resistor at the receiving end. Additionally, use a 50-ohm transmission line impedance and maintain a consistent signal return path.
To ensure reliable operation in high-temperature environments, ensure that the device is operated within its recommended operating temperature range (-40°C to 85°C). Also, provide adequate heat sinking, use a thermally conductive material for the PCB, and consider using a heat spreader or thermal interface material.
The recommended power sequencing is to power up the VCC supply before the VTT supply. The VCC supply should be powered up to a minimum of 2.3V before the VTT supply is powered up. The VTT supply should be powered up to a minimum of 1.65V.
To troubleshoot signal integrity issues, use an oscilloscope to measure the signal waveform and check for signal reflections, ringing, or distortion. Verify that the signal traces are properly terminated, and the signal return path is consistent. Also, check the power supply noise and ensure that it is within the recommended specifications.
To minimize EMI and RFI, use a shielded enclosure, keep the signal traces short and away from the edge of the board, and use a common-mode choke or ferrite bead on the signal lines. Also, ensure that the power supply is well-regulated and filtered to minimize noise.
DS26LV32ATM/NOPB datasheet
by Texas Instruments
