A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the signal traces short and away from noise sources. Use a common mode filter or a ferrite bead to reduce EMI.
Use a heat sink or a thermal pad to dissipate heat. Ensure good airflow around the device. Consider using a thermal interface material to improve heat transfer. Monitor the device's junction temperature to prevent overheating.
Use level shifters or voltage translators to ensure signal integrity between different voltage domains. Ensure that the device's power supply is decoupled from other voltage domains to prevent noise coupling.
Use an oscilloscope to analyze signal waveforms and identify issues. Check the power supply voltage and current consumption. Verify that the device is properly configured and that the clock signals are stable.
Use controlled impedance traces and terminations to minimize signal reflections. Ensure that the signal traces are short and well-shielded to reduce EMI. Use a signal integrity analysis tool to simulate and optimize the signal transmission.