A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the signal traces short and away from the power plane to minimize noise and radiation.
Implement thermal management techniques such as heat sinks, thermal vias, and thermal interface materials. Ensure good airflow and avoid blocking airflow around the component.
While the datasheet specifies a maximum frequency of 100 MHz, some users have reported successful operation up to 200 MHz. However, this may require careful PCB design and signal integrity analysis.
The POR and BOD features can be controlled through external resistors and capacitors. Consult the datasheet and application notes for specific guidance on implementing these features.
Use 0.1 μF to 1 μF decoupling capacitors placed as close as possible to the power pins. Additional capacitors may be required depending on the specific application and PCB layout.