A good PCB layout for the DPA425GN-TL should prioritize thermal dissipation. Place the device near a thermal pad or a heat sink, and ensure good copper pour connectivity to dissipate heat. Avoid routing high-current traces under the device, and keep the thermal pad connected to a solid ground plane.
To ensure reliable start-up and shutdown, ensure that the input voltage rises and falls monotonically, and that the enable pin (EN) is properly driven. A soft-start circuit can help reduce inrush current and prevent false triggering. Also, ensure that the output voltage is properly clamped during shutdown to prevent voltage spikes.
For optimal EMI performance, keep the switching node (SW) away from sensitive analog circuits, and use a common-mode choke or ferrite bead to filter high-frequency noise. Ensure that the layout is symmetrical and balanced, and that the input and output capacitors are placed close to the device. Use a shielded inductor or a toroidal inductor to reduce radiated emissions.
To optimize output voltage regulation and accuracy, ensure that the feedback resistors (RFBT and RFB) are properly selected, and that the output voltage sense lines are properly routed. Use a low-ESR output capacitor to minimize voltage ripple, and consider adding a voltage reference or a voltage regulator module for improved accuracy.
The DPA425GN-TL has a maximum junction temperature (TJ) of 150°C. Ensure good airflow around the device, and consider using a heat sink or thermal pad to dissipate heat. Monitor the device temperature using the thermal monitoring pin (TM) and implement thermal shutdown or warning mechanisms to prevent overheating.
DPA425GN-TL datasheet
by Power Integrations
