A good PCB layout for the DL4002-13 should include a solid ground plane, wide power traces, and a thermal relief pattern under the IC to facilitate heat dissipation. A minimum of 2oz copper thickness is recommended.
To ensure stable operation with a high-ESR output capacitor, add a 1-2nF ceramic capacitor in parallel with the output capacitor to reduce the effective ESR. Additionally, consider using a low-ESR output capacitor or a capacitor with built-in ESR reduction features.
The maximum allowed voltage on the EN pin is 6V. Exceeding this voltage may damage the internal circuitry. It is recommended to use a voltage divider or a level shifter if the enable signal is derived from a higher voltage source.
The DL4002-13 is rated for operation up to 125°C. However, the device's performance and reliability may degrade at high temperatures. Consider using a heat sink or a thermal interface material to reduce the junction temperature. Consult the datasheet for thermal derating information.
To minimize EMI, use a shielded inductor, keep the switching node (SW) as short as possible, and use a common-mode choke on the input lines. Additionally, consider using a spread-spectrum clock generator or a clock frequency modulation technique to reduce EMI.
DL4002-13 datasheet
by Diodes Incorporated
