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    Part Img DG413LDQ-T1-E3 datasheet by Vishay Siliconix

    • Interface - Analog Switches, Multiplexers, Demultiplexers, Integrated Circuits (ICs), IC SWITCH QUAD SPST LV 16-TSSOP
    • Original
    • Unknown
    • Yes
    • Obsolete
    • 8542.39.00.01
    • 8542.39.00.00
    • Find it at Findchips.com

    DG413LDQ-T1-E3 datasheet preview

    DG413LDQ-T1-E3 Frequently Asked Questions (FAQs)

    • The recommended land pattern for the DG413LDQ-T1-E3 can be found in the Vishay Intertechnologies' application note AN81142, which provides guidelines for PCB layout and land pattern design.
    • To handle the ESD sensitivity of the DG413LDQ-T1-E3, it is recommended to follow proper ESD handling procedures, such as using an ESD wrist strap or mat, and ensuring that the device is stored in an ESD-safe environment. Additionally, the device should be handled in a static-free environment, and any static-sensitive devices should be grounded before handling.
    • The maximum operating temperature range for the DG413LDQ-T1-E3 is -40°C to +125°C, as specified in the datasheet. However, it's essential to note that the device's performance may degrade at extreme temperatures, and the user should consult the datasheet and application notes for specific temperature-related guidelines.
    • The DG413LDQ-T1-E3 is a commercial-grade device, and its use in high-reliability or aerospace applications may require additional testing and qualification. It is recommended to consult with Vishay Intertechnologies' sales team or application engineers to determine the device's suitability for such applications and to discuss any necessary testing or certification requirements.
    • To ensure the reliability of the DG413LDQ-T1-E3 in a humid or high-temperature environment, it is recommended to follow proper storage and handling procedures, such as storing the device in a dry, cool place, and avoiding exposure to moisture or extreme temperatures. Additionally, the user should consider using conformal coating or other environmental protection methods to protect the device from humidity and temperature-related stresses.
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