The recommended PCB footprint for the DG401DY-T1-E3 is a standard SOT23-3 package with a minimum pad size of 0.8mm x 0.8mm and a maximum pad size of 1.2mm x 1.2mm, with a non-solder mask defined (NSMD) pad shape.
To ensure proper soldering, use a soldering iron with a temperature range of 250°C to 260°C, and apply a solder flux to the pads. Use a solder with a melting point of 217°C to 220°C, and avoid applying excessive heat or pressure to the component.
The DG401DY-T1-E3 has an operating temperature range of -40°C to 125°C, but it's recommended to operate within -20°C to 85°C for optimal performance and reliability.
Yes, the DG401DY-T1-E3 is suitable for high-reliability and automotive applications, as it meets the requirements of AEC-Q101 and is manufactured in accordance with IATF 16949:2016 standards.
To prevent electrostatic discharge (ESD) damage, handle the DG401DY-T1-E3 with an ESD wrist strap or mat, and ensure that the workspace and equipment are ESD-protected. Avoid touching the component pins or handling the component in a way that could generate static electricity.
DG401DY-T1-E3 datasheet
by Vishay Siliconix
