The recommended PCB footprint for the DG2715DL-T1-E3 is a 1.6 mm x 0.8 mm pad with a 0.3 mm x 0.3 mm thermal pad. It's essential to follow the recommended footprint to ensure proper thermal performance and to prevent overheating.
The DG2715DL-T1-E3 is rated for operation up to 125°C. However, it's essential to consider the derating curves and thermal management to ensure the device operates within its specified limits. Consult the datasheet and application notes for more information.
To ensure proper soldering, follow the recommended soldering profile: peak temperature of 260°C, soldering time of 10 seconds, and a soldering iron temperature of 350°C. Additionally, use a solder with a melting point above 217°C to prevent thermal damage.
The maximum allowed voltage for the DG2715DL-T1-E3 is 1.5 V. Exceeding this voltage may cause permanent damage to the device. Ensure that the voltage supply is within the specified limits to guarantee reliable operation.
The DG2715DL-T1-E3 is designed for low-frequency applications up to 100 kHz. While it may work in higher-frequency applications, its performance may degrade. Consult the datasheet and application notes for more information on high-frequency operation.
DG2715DL-T1-E3 datasheet
by Vishay Siliconix
