The recommended PCB footprint and land pattern for the DG2711DL-T1-E3 can be found in the Vishay Intertechnologies' application note AN81142, which provides detailed guidelines for PCB layout and assembly.
To ensure reliability and longevity in high-temperature applications, it is essential to follow proper derating guidelines, provide adequate heat sinking, and ensure that the device is operated within its recommended operating conditions. Additionally, consider using a thermally conductive interface material and a heat sink with a high thermal conductivity.
The DG2711DL-T1-E3 is an ESD-sensitive device and requires proper handling and storage precautions. It is recommended to handle the device in an ESD-controlled environment, use ESD-protective packaging, and follow proper grounding procedures during assembly and testing.
Yes, the DG2711DL-T1-E3 is AEC-Q101 qualified, which makes it suitable for use in automotive applications. However, it is essential to ensure that the device is used within its recommended operating conditions and that the application meets the required automotive standards and regulations.
The recommended soldering profile for the DG2711DL-T1-E3 can be found in the Vishay Intertechnologies' application note AN77355, which provides detailed guidelines for soldering and assembly. It is essential to follow a controlled soldering process to prevent damage to the device.
DG2711DL-T1-E3 datasheet
by Vishay Siliconix
