A good PCB layout for optimal thermal performance would be to have a solid ground plane on the bottom layer, and to use thermal vias to connect the exposed pad to the ground plane. This helps to dissipate heat efficiently.
To ensure proper power-up and configuration, follow the recommended power-up sequence, and make sure to tie the EN pin high to enable the device. Also, configure the device according to the datasheet recommendations for the desired output voltage and current limit.
When selecting output capacitors, consider the capacitance value, equivalent series resistance (ESR), and voltage rating. A general rule of thumb is to use a capacitor with a capacitance value of at least 10uF, an ESR of less than 100mΩ, and a voltage rating of at least 2x the output voltage.
To troubleshoot issues, start by checking the input voltage, output voltage, and current. Verify that the device is properly configured and that the output capacitors are suitable. Check for any signs of overheating, and ensure that the device is properly mounted on a heat sink if necessary. Consult the datasheet and application notes for more detailed troubleshooting guidance.
Operating the device at high ambient temperatures can reduce its reliability and lifespan. Ensure that the device is properly heat-sinked and that the ambient temperature is within the recommended operating range. Consult the datasheet for thermal derating information and take necessary precautions to prevent overheating.