A thermal pad is recommended under the package to improve heat dissipation. A minimum of 2oz copper thickness and a thermal relief pattern are suggested. Refer to the application note for detailed layout guidelines.
Implement a thermal management system to keep the junction temperature below 150°C. Use a heat sink, thermal interface material, and ensure good airflow. Monitor the device's thermal resistance and adjust the system accordingly.
The maximum allowed voltage transient on the input pins is ±20% of the recommended operating voltage. Exceeding this may cause damage to the device. Implement proper voltage regulation and filtering to ensure compliance.
Yes, the DBLS105G is suitable for high-reliability and automotive applications. However, additional testing and qualification may be required. Consult with Taiwan Semiconductor's sales team or application engineers for guidance on specific requirements.
Check the oscillator circuit for proper component values and layout. Ensure the oscillator input pins are not loaded or have excessive capacitance. Consult the application note for oscillator design guidelines and troubleshooting tips.
