DB3X316F0L datasheet by Panasonic Electronic Components

DB3X316F0L Frequently Asked Questions (FAQs)

• What is the recommended land pattern for the DB3X316F0L?
  The recommended land pattern for the DB3X316F0L is a rectangular pad with a size of 2.5mm x 1.6mm, with a solder mask opening of 2.2mm x 1.3mm.
• How do I handle the thermal considerations for the DB3X316F0L?
  The DB3X316F0L has a thermal resistance of 10°C/W. To handle thermal considerations, ensure good airflow around the component, use a heat sink if necessary, and follow proper PCB design guidelines for thermal management.
• What is the maximum operating temperature range for the DB3X316F0L?
  The maximum operating temperature range for the DB3X316F0L is -40°C to 125°C.
• Can I use the DB3X316F0L in a high-vibration environment?
  Yes, the DB3X316F0L is designed to withstand vibrations up to 10G. However, it's recommended to follow proper mounting and soldering guidelines to ensure reliability in high-vibration environments.
• How do I ensure the reliability of the DB3X316F0L in humid environments?
  To ensure reliability in humid environments, follow proper moisture-sensitive device handling guidelines, use a moisture barrier bag during storage, and consider applying a conformal coating to the PCB.