CPCP10100R0JE32 datasheet by Vishay Dale

CPCP10100R0JE32 Frequently Asked Questions (FAQs)

• What is the recommended land pattern for CPCP10100R0JE32?
  The recommended land pattern for CPCP10100R0JE32 is a rectangular pad with a size of 2.5 mm x 1.25 mm, with a non-solder mask defined (NSMD) pad shape.
• Can CPCP10100R0JE32 be used in high-temperature applications?
  Yes, CPCP10100R0JE32 is rated for operation up to 150°C, making it suitable for high-temperature applications. However, the device's power rating should be derated accordingly.
• How do I handle the CPCP10100R0JE32 during assembly to prevent damage?
  Handle CPCP10100R0JE32 by the body, avoiding touching the leads or the ceramic substrate to prevent damage. Use anti-static precautions and follow standard ESD handling procedures.
• Can CPCP10100R0JE32 be used in high-frequency applications?
  Yes, CPCP10100R0JE32 is suitable for high-frequency applications up to several hundred MHz. However, the device's performance may degrade at very high frequencies due to parasitic inductance and capacitance.
• What is the recommended soldering profile for CPCP10100R0JE32?
  The recommended soldering profile for CPCP10100R0JE32 is a peak temperature of 260°C, with a dwell time of 10-30 seconds. The device should be soldered using a no-clean or water-soluble flux.