A 4-layer PCB with a thermal via array underneath the device is recommended. The thermal vias should be connected to a solid copper plane on the bottom layer to dissipate heat efficiently.
Use a low-loss substrate, minimize trace lengths, and use a 50-ohm transmission line to match the device's output impedance. Also, ensure proper decoupling and bypassing of the power supply lines.
The maximum junction temperature (Tj) is 150°C. However, it's recommended to operate the device at a temperature below 125°C to ensure reliable operation and minimize degradation.
Yes, the CMPA2735075F1 can be used in a push-pull configuration. However, ensure that the devices are properly matched, and the layout is symmetrical to minimize uneven heating and thermal runaway.
The recommended input and output matching networks can be found in the application note or the device's evaluation board documentation. These networks are optimized for maximum power transfer and minimum loss.
