API Delevan recommends a PCB layout with a solid ground plane and thermal vias to dissipate heat. A minimum of 2 oz copper thickness is recommended. Additionally, a thermal interface material (TIM) with a thermal conductivity of at least 1 W/m-K is suggested to improve heat transfer between the device and the heat sink.
The CM6350-104 requires a bias voltage of 15V to 30V, and a bias current of 100mA to 200mA. Ensure that the bias circuit is designed to provide a stable voltage and current, and that the device is properly terminated to prevent oscillations.
The CM6350-104 is rated for a maximum power handling of 50W. However, the actual power handling capability may vary depending on the operating frequency, bias conditions, and thermal management. It is recommended to derate the power handling by 20% to ensure reliable operation.
Common issues such as oscillations or instability can be caused by improper biasing, inadequate thermal management, or poor PCB layout. Troubleshoot by checking the bias voltage and current, ensuring proper thermal management, and verifying the PCB layout against the recommended layout. Additionally, check for any signs of overheating, such as excessive temperature rise or thermal runaway.
Yes, the CM6350-104 is a sensitive device and requires proper ESD handling and storage. Handle the device with ESD-safe materials, and store it in a static-shielding bag or container. Ensure that the device is properly grounded during handling and storage to prevent ESD damage.
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