The recommended PCB land pattern for CIH10T1N5SNC is a rectangular pad with a size of 3.5mm x 2.5mm, with a 0.5mm gap between the pads. This ensures proper soldering and heat dissipation.
To handle the high current rating of CIH10T1N5SNC, ensure that the PCB traces and vias are designed to handle the maximum current rating. Use thicker traces (at least 1 oz copper) and multiple vias to reduce resistance and heat generation.
The thermal resistance of the CIH10T1N5SNC is not explicitly stated in the datasheet. However, according to Samsung's application notes, the thermal resistance is typically around 10-15°C/W. This value can be used for thermal design and simulation.
The CIH10T1N5SNC is rated for operation up to 125°C. However, it's essential to consider the derating curve and ensure that the inductor does not exceed its maximum operating temperature. Consult Samsung's application notes for more information on high-temperature operation.
To ensure the CIH10T1N5SNC meets your application's EMI requirements, consider using shielding, filtering, and proper PCB layout techniques. Additionally, consult Samsung's EMI guidelines and application notes for specific recommendations on using the CIH10T1N5SNC in EMI-sensitive applications.
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