CIG10F2R2MNC datasheet by Samsung Electro-Mechanics

CIG10F2R2MNC Frequently Asked Questions (FAQs)

• What is the recommended land pattern for CIG10F2R2MNC?
  The recommended land pattern for CIG10F2R2MNC is a rectangular pad with a size of 1.5mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape.
• How do I handle the component's moisture sensitivity?
  CIG10F2R2MNC is a moisture-sensitive device. It's recommended to store it in a dry environment (less than 20% RH) and handle it according to the JEDEC J-STD-033 standard to prevent moisture absorption.
• What is the maximum reflow temperature for CIG10F2R2MNC?
  The maximum reflow temperature for CIG10F2R2MNC is 260°C, with a peak temperature not exceeding 240°C for more than 20 seconds.
• Can I use CIG10F2R2MNC in high-vibration applications?
  While CIG10F2R2MNC is designed to be robust, it's not specifically designed for high-vibration applications. If you need to use it in such an environment, ensure that the component is properly secured and consider additional mechanical support.
• How do I troubleshoot issues with CIG10F2R2MNC?
  To troubleshoot issues with CIG10F2R2MNC, check for proper soldering, ensure correct component orientation, and verify that the operating conditions are within the specified range. If issues persist, consult the datasheet and contact Samsung Electro-Mechanics support for further assistance.