The recommended soldering temperature profile for the CIC21P300NE is 250°C for 3-5 seconds, with a peak temperature of 260°C for 1-2 seconds.
Yes, the CIC21P300NE is suitable for high-frequency applications up to 1 GHz due to its low equivalent series resistance (ESR) and high self-resonant frequency.
The CIC21P300NE is rated for operation up to 125°C, with a derating of capacitance and insulation resistance above 85°C. It is suitable for use in high-temperature environments, but with reduced performance.
Yes, the CIC21P300NE is compatible with lead-free soldering processes, including SAC305 and SnAgCu alloys.
The recommended land pattern for the CIC21P300NE is a rectangular pad with a size of 3.5 mm x 2.5 mm, with a solder mask opening of 3.1 mm x 2.1 mm.
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