CDCLVD2108RGZT datasheet by Texas Instruments

CDCLVD2108RGZT Frequently Asked Questions (FAQs)

• What is the recommended layout and routing for the CDCLVD2108RGZT to minimize jitter and ensure optimal performance?
  Texas Instruments recommends a symmetrical layout with matched trace lengths and impedance-controlled routing to minimize jitter. A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Additionally, use a common mode filter or a pi-filter to reduce noise and ensure a clean power supply.
• How do I properly terminate the output of the CDCLVD2108RGZT to prevent signal reflections and ensure signal integrity?
  Use a 50-ohm termination resistor in series with a 0.01uF capacitor to ground at the output of the device. This will help to match the impedance and prevent signal reflections. Additionally, use a series resistor and a shunt capacitor to further improve signal integrity.
• What is the recommended power supply decoupling and filtering for the CDCLVD2108RGZT?
  Use a 10uF capacitor in parallel with a 0.1uF capacitor and a 10-ohm resistor in series to decouple the power supply. Add a pi-filter or a common mode filter to further reduce noise and ensure a clean power supply. Place the decoupling capacitors as close to the device as possible.
• How do I configure the CDCLVD2108RGZT for a specific clock frequency and output format?
  Use the TI Clock Design Tool or the CDCLVD2108RGZT datasheet to determine the correct register settings for the desired clock frequency and output format. The device can be configured using the I2C interface or by using the internal register settings.
• What are the thermal considerations for the CDCLVD2108RGZT, and how do I ensure reliable operation over temperature?
  The CDCLVD2108RGZT has a maximum junction temperature of 150°C. Ensure good thermal conductivity by using a thermal pad or a heat sink. Keep the device away from heat sources and ensure good airflow. Use thermal simulation tools to analyze the thermal performance of the design.