BZX84C4V7-TP datasheet by Micro Commercial Components

BZX84C4V7-TP Frequently Asked Questions (FAQs)

• What is the recommended footprint for the BZX84C4V7-TP?
  The recommended footprint for the BZX84C4V7-TP is a standard SOD123 package with a pad size of 1.3mm x 0.8mm.
• Can I use the BZX84C4V7-TP in a high-reliability application?
  Yes, the BZX84C4V7-TP is suitable for high-reliability applications due to its low leakage current and high stability over temperature.
• How do I ensure the BZX84C4V7-TP is properly soldered?
  To ensure proper soldering, use a soldering iron with a temperature of 250°C to 260°C, and apply a small amount of solder paste to the pads. Avoid overheating the component.
• What is the maximum allowable power dissipation for the BZX84C4V7-TP?
  The maximum allowable power dissipation for the BZX84C4V7-TP is 500mW, and it is recommended to derate the power dissipation based on the ambient temperature.
• Can I use the BZX84C4V7-TP in a high-frequency application?
  The BZX84C4V7-TP is suitable for low-to-medium frequency applications up to 100kHz. For higher frequency applications, consider using a different zener diode with a faster response time.