BZX79-C8V2 datasheet by NXP Semiconductors

BZX79-C8V2 Frequently Asked Questions (FAQs)

• What is the recommended footprint for the BZX79-C8V2?
  The recommended footprint for the BZX79-C8V2 is a standard SOD523 package with a minimum pad size of 0.6 mm x 0.6 mm and a maximum pad size of 1.2 mm x 1.2 mm.
• Can I use the BZX79-C8V2 in a high-temperature environment?
  The BZX79-C8V2 is rated for operation up to 150°C, but it's recommended to derate the voltage and current ratings above 125°C to ensure reliable operation. Consult the datasheet for specific derating guidelines.
• How do I handle ESD protection when working with the BZX79-C8V2?
  The BZX79-C8V2 has an internal ESD protection diode, but it's still recommended to follow standard ESD handling precautions when handling the device, such as using an ESD wrist strap or mat, and storing the device in an anti-static bag or container.
• Can I use the BZX79-C8V2 as a voltage regulator?
  While the BZX79-C8V2 can be used as a voltage regulator, it's not recommended due to its limited current handling capability and lack of regulation features. Instead, consider using a dedicated voltage regulator IC for voltage regulation applications.
• What is the typical leakage current of the BZX79-C8V2?
  The typical leakage current of the BZX79-C8V2 is around 1-5 μA at room temperature, but this can vary depending on the operating voltage and temperature. Consult the datasheet for specific leakage current characteristics.