NXP provides a recommended PCB layout in the application note AN11160, which includes guidelines for thermal vias, copper thickness, and component placement to ensure optimal thermal performance.
The gate driver selection depends on the specific application requirements, such as voltage, current, and switching frequency. NXP recommends using a gate driver with a high current capability and a low output impedance to ensure fast switching times and minimal power loss. The UCC37322 or the FAN5350 are suitable options.
Although the datasheet specifies a maximum Vgs of ±20V, it's recommended to limit the gate-source voltage to ±15V to ensure reliable operation and prevent damage to the MOSFET.
The internal diode can cause voltage spikes during switching. To mitigate this, use a snubber circuit or a diode clamp to limit the voltage spike. Additionally, ensure the gate driver is capable of handling the diode's reverse recovery charge.
Although the datasheet specifies an operating temperature range of -55°C to 150°C, it's recommended to operate the MOSFET within a range of -40°C to 125°C for optimal performance and reliability.
BZB784-C2V4,115 datasheet
by NXP Semiconductors
